Effects of copper foil design on heating by sleeve

Name: Kuwabara, Kota

Organization : National Institute of Technology (KOSEN)

Name: Fukuoka, Hiroshi

Organization : National Institute of Technology (KOSEN)

Email : fukuoka@mech.nara-k.ac.jp

Name: Suda, Atsushi

Organization : National Institute of Technology (KOSEN)

Name: Taniguchi, Yukinori

Organization : National Institute of Technology (KOSEN)

Name: Uwano, Hidetake

Organization : National Institute of Technology (KOSEN)

keyword: Infrared thermography

LCSH: Solder and soldering -- Quality control

LCSH: Boundary scan testing -- Design and construction

LCSH: Copper foil -- Thermal properties

LCSH: Automobiles -- Electronic equipment -- Manufacturing

Abstract: Sleeve soldering has recently been used in manufacturing automotive parts due to its high reliability. With the evolution of automobiles, high-density PCBs have come to be used in automotive parts. The PCBs have high heat dissipation properties. However, PCBs with high heat dissipation properties are prone to soldering defects due to their insufficient temperature rise. We aim to acquire fundamental knowledge from the thermal behavior perspective for designing PCBs with fewer soldering defects. The PCBs use a large amount of copper foil. Therefore, this study investigates the effects of the thermal capacity and surface area of the copper foil of PCBs on the temperature of the PCBs during sleeve soldering. In the experiment, we heated the PCB using a sleeve equivalent to a soldering iron and measured the temperatures of the PCB and sleeve using infrared thermography. The thermal capacities of the copper foils are 0.0269 J/K and 0.105 J/K. The surface areas of the copper foils are 229 square millimeters and 873 square millimeters. In the case of the heat capacity of the copper foil was increased from 0.0269 J/K to 0.105 J/K, the representative temperature of the PCB after 2.5 seconds of heating decreased by 46.0 degrees Celsius. Based on this result, it is suggested that reducing the heat capacity of the copper foil within the experimental range could lead to design guidelines for PCBs with fewer soldering defects. In the case of increasing the surface area of the copper foil from 229 square millimeters to 873 square millimeters, the representative temperature of the PCB during 2.5 seconds of heating increased by 27.0 degrees Celsius. Based on this result, it is considered that within the experimental range, reducing the thickness of the copper foil to increase the surface area does not lead to a reduction in the temperature of the PCB

King Mongkut's University of Technology North Bangkok. Central Library

Address: BANGKOK

Email: library@kmutnb.ac.th

Created: 2025

Modified: 2026-06-26

Issued: 2026-06-26

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BibliograpyCitation : In Thai Society of Mechanical Engineer (TSME) and Mahanakorn University of Technology (MUT). The 15th TSME International Conference on Mechanical Engineering (TSME-ICoME 2025) (TSF0008). Bangkok : Mahanakorn University of Technology

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