Abstract:
flThis research presents the study and development of photolithography process that is an
indispensible process in Integrated Circuit (IC) fabrication to reduce the Optical Proximity Error
(OPE), which is a cricital issue defecting feature size and configuration during the exposure. The
model-based OPC technique that is one of the Optical Proximity Correction (OPC) techniques,
extensively used to minimize the OPE is attempted using the OPTOLITH simulator to control
feature size and pattern on Si wafers. Simulated results are verified with the actual experiments by
measuring a virtual image of the exposed light incident onto the wafer. Contact hole and Poly gate
with different pattern densities are two test features of interest. A Better feature control is realized
after using the OPC. The simulation of the contact hole provides a less error than that of the
poly gate since in the experiments the polygate is overly developed. The prediction models of the
photolithography offers higher than 0.9 correlation level for developed depth, removal thickness,
and critical dimension.